ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,329, issued on May 20, was assigned to Intel Corp. (Santa Clara, Calif.).
"Chiplet first architecture for die tiling applications" was invented by Srinivas Pietambaram (Chandler, Ariz.), Gang Duan (Chandler, Ariz.), Deepak Kulkarni (Chandler, Ariz.), Rahul Manepalli (Chandler, Ariz.) and Xiaoying Guo (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a mold layer having a first surface and a second surface opposite the first surface, and a plurality of first dies embedded in the mol...