US Patent Issued to Intel on May 13 for "Wire-bonding methodologies utilizing preformed glass optical wires for making chip-to-chip optical interfaces" (California Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,556, issued on May 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Wire-bonding methodologies utilizing preformed glass optical wires for making chip-to-chip optical interfaces" was invented by Alexander Krichevsky (Cupertino, Calif.) and Boping Xie (San Ramon, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a ...