US Patent Issued to Intel on May 13 for "Microelectronic assemblies with communication networks" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,666, issued on May 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies with communication networks" was invented by Adel A. Elsherbini (Tempe, Ariz.), Amr Elshazly (Hillsboro, Ore.), Arun Chandrasekhar (Chandler, Ariz.), Shawna M. Liff (Scottsdale, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the firs...