ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,626, issued on May 13, was assigned to Intel Corp. (Santa Clara, Calif.).
"Microelectronic assemblies" was invented by Shawna M. Liff (Scottsdale, Ariz.), Adel A. Elsherbini (Chandler, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a first die comprising a first face and a second face; and a second die, the second die comprising a first face and a second face, wherein the second die further comprises a plurality of first conductive contacts at the fir...