US Patent Issued to Intel on May 13 for "Liquid cooled interposer for integrated circuit stack" (Arizona, California, Oregon Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,579, issued on May 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Liquid cooled interposer for integrated circuit stack" was invented by Georgios Dogiamis (Chandler, Ariz.), Qiang Yu (Saratoga, Calif.), Feras Eid (Chandler, Ariz.), Adel Elsherbini (Tempe, Ariz.), Kimin Jun (Portland, Ore.), Johanna Swan (Scottsdale, Ariz.) and Shawna Liff (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package may be fabricated having an interposer, one or more microfluidic channels through the interposer, a first IC chip attached to a first side of the interposer, and a second IC chip attached to a second side o...