US Patent Issued to Intel on May 13 for "Inorganic-based embedded-die layers for modular semiconductive devices" (Arizona Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,620, issued on May 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Inorganic-based embedded-die layers for modular semiconductive devices" was invented by Srinivas V. Pietambaram (Chandler, Ariz.), Tarek Ibrahim (Mesa, Ariz.), Kristof Darmawikarta (Chandler, Ariz.), Rahul N. Manepalli (Chandler, Ariz.), Debendra Mallik (Chandler, Ariz.) and Robert L. Sankman (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "A glass substrate houses an embedded multi-die interconnect bridge that is part of a semiconductor device package. Through-glass vias communicate to a surface for mounting on a semiconductor package substrate."

The patent was filed...