ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,613, issued on May 13, was assigned to Intel Corp. (Santa Clara, Calif.).
"Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate" was invented by Robert Alan May (Chandler, Ariz.), Kristof Darmawikarta (Chandler, Ariz.) and Sri Ranga Sai Sai Boyapati (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die interconnect substrate comprises a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate comprises a multilayer substrate structure comprising a substrate in...