US Patent Issued to Intel on March 4 for "Thermal management in horizontally or vertically stacked dies" (American, Indian Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,242,315, issued on March 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Thermal management in horizontally or vertically stacked dies" was invented by Somvir Singh Dahiya (Bengaluru, India), Stephen Gunther (Beaverton, Ore.), Julien Sebot (Portland, Ore.), Randy Osborne (Beaverton, Ore.), Scot Kellar (Bend, Ore.) and Joshua Een (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal management scheme, for a multichip module, that is aware of various dies in a stack (horizontal and/or vertical) and heat generated from them, local hot spots in a victim die, and hot spots in aggressor die(s). Each victim die receives telemetry info...