US Patent Issued to Intel on March 4 for "Nested architectures for enhanced heterogeneous integration" (Arizona Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,806, issued on March 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Nested architectures for enhanced heterogeneous integration" was invented by Ravindranath Mahajan (Chandler, Ariz.), Debendra Mallik (Chandler, Ariz.), Sujit Sharan (Chandler, Ariz.) and Digvijay Raorane (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a base substrate. The base substrate may have a plurality of through substrate vias. In an embodiment, a first die is over the base substrate. In an embodim...