US Patent Issued to Intel on March 4 for "Microelectronic assemblies having topside power delivery structures" (German, American Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,828, issued on March 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies having topside power delivery structures" was invented by Bernd Waidhas (Pettendorf, Germany), Carlton Hanna (Santa Jose, Calif.), Stephen Morein (San Jose, Calif.), Lizabeth Keser (San Diego) and Georg Seidemann (Landshut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate including a first conductive pathway electrically coupled to a power source; a mold material on the package substrat...