US Patent Issued to Intel on March 25 for "Wafer support member and method of manufacturing a wafer support member" (Washington, California Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,068, issued on March 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Wafer support member and method of manufacturing a wafer support member" was invented by Peter Davison (Puyallup, Wash.) and Paul Gwin (Orangevale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "There may be provided a wafer support member which may include a support column and a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column. Each wafer-engagement-shelf may define a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the w...