ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,097, issued on March 25, was assigned to Intel Corp. (Santa Clara, Calif.).
"Thermal management in integrated circuit packages" was invented by Feras Eid (Chandler, Ariz.), Telesphor Kamgaing (Chandler, Ariz.), Georgios Dogiamis (Chandler, Ariz.), Aleksandar Aleksov (Chandler, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages."
The patent was filed on Aug. 8, 2023, under Application No. 18/366,734.
*For further information, including images, charts and tables, please visit: http://pa...