US Patent Issued to Intel on March 25 for "Mold shelf package design and process flow for advanced package architectures" (Arizona Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,150, issued on March 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Mold shelf package design and process flow for advanced package architectures" was invented by Wei Li (Chandler, Ariz.), Edvin Cetegen (Chandler, Ariz.), Nicholas S. Haehn (Scottsdale, Ariz.), Ram S. Viswanath (Phoenix), Nicholas Neal (Gilbert, Ariz.) and Mitul Modi (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include semiconductor packages and a method to form such semiconductor packages. A semiconductor package includes a plurality of dies on a substrate, and an encapsulation layer over the substrate. The encapsulation layer surrounds the dies. The...