US Patent Issued to Intel on March 25 for "Metallization stacks with self-aligned staggered metal lines" (Oregon Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,114, issued on March 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Metallization stacks with self-aligned staggered metal lines" was invented by Elijah V. Karpov (Portland, Ore.), Christopher J. Jezewski (Portland, Ore.), Manish Chandhok (Beaverton, Ore.), Nafees A. Kabir (Portland, Ore.) and Matthew V. Metz (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for fabricating metallization stacks with one or more self-aligned staggered metal lines, and related semiconductor devices, are disclosed. Methods and devices are based on providing a spacer material conformal to bottom metal lines of a first layer of a metallizat...