US Patent Issued to Intel on March 25 for "Heat pipe for improved thermal performance at cold plate interface" (Oregon, California Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,508, issued on March 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Heat pipe for improved thermal performance at cold plate interface" was invented by Juha Paavola (Hillsboro, Ore.), Columbia Mishra (Mountain View, Calif.), Justin Huttula (Portland, Ore.) and Mark Carbone (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, ...