US Patent Issued to Intel on March 25 for "Embedded die architecture and method of making" (Arizona Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,124, issued on March 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Embedded die architecture and method of making" was invented by Sanka Ganesan (Chandler, Ariz.), Robert L. Sankman (Phoenix) and Sri Chaitra Jyotsna Chavali (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various examples provide a semiconductor package. The semiconductor package includes a substrate having first and second opposed substantially planar major surfaces extending in an x-y direction. The package further includes a bridge die having third and fourth opposed substantially planar major surfaces extending in the x-y direction. The third substantia...