US Patent Issued to Intel on March 18 for "Sideways vias in isolation areas to contact interior layers in stacked devices" (Oregon Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,137, issued on March 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Sideways vias in isolation areas to contact interior layers in stacked devices" was invented by Ehren Mannebach (Beaverton, Ore.), Aaron Lilak (Beaverton, Ore.), Hui Jae Yoo (Portland, Ore.), Patrick Morrow (Portland, Ore.), Anh Phan (Beaverton, Ore.), Willy Rachmady (Beaverton, Ore.), Cheng-Ying Huang (Portland, Ore.), Gilbert Dewey (Beaverton, Ore.) and Rishabh Mehandru (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic systems with vias that include a horizontal and vertical portion in order to provide intercon...