ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,487, issued on March 18, was assigned to Intel Corp. (Santa Clara, Calif.).
"Hybrid boards with embedded planes" was invented by Jackson Chung Peng Kong (Tanjung Tokong, Malaysia), Bok Eng Cheah (Gelugor, Malaysia), Jenny Shio Yin Ong (Bayan Lepas, Malaysia), Seok Ling Lim (Kulim, Malaysia), Chin Lee Kuan (Pahang, Malaysia) and Tin Poay Chuah (Bayan Baru, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a hybrid dielectric interconnect stack for a printed circuit board having a first dielectric layer with a first dielectric constant and a first dielectric loss tangent positioned over an intermediate laye...