US Patent Issued to Intel on March 18 for "Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein" (Arizona Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,147, issued on March 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein" was invented by Jeremy Ecton (Gilbert, Ariz.), Brandon Marin (Gilbert, Ariz.), Srinivas Pietambaram (Chandler, Ariz.) and Suddhasattwa Nad (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic substrate may be fabricated having at least two glass layers separated by an etch stop layer, wherein a bridge is embedded within one of the glass layers. The depth of a cavity formed for embedding the bridge is control by the thickness of the glass layer rather ...