US Patent Issued to Intel on March 11 for "Thermal contacts at periphery of integrated circuit packages" (German Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,553, issued on March 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"Thermal contacts at periphery of integrated circuit packages" was invented by Sonja Koller (Regensburg, Germany), Vishnu Prasad (Munich) and Georg Seidemann (Landshut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Present disclosure relates to IC packages with integrated thermal contacts. In some embodiments, an IC package includes a package substrate, an IC die that is coupled to the package substrate, and at least one thermal contact for coupling to at least a portion of a heat exchanger, where the thermal contact is limited to being in a region located at a per...