US Patent Issued to Intel on March 11 for "Cap structure for interconnect dielectrics and methods of fabrication" (Oregon Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,577, issued on March 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"Cap structure for interconnect dielectrics and methods of fabrication" was invented by Shashi Vyas (Hillsboro, Ore.), Sudipto Naskar (Portland, Ore.) and Charles Wallace (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a first interconnect level including a first dielectric between a pair of interconnect structures, a second interconnect level above the first interconnect level. The second interconnect level includes a cap structure including a second dielectric on the first dielectric, the cap structure includes a top...