US Patent Issued to Intel on June 3 for "Integrated silicon photonics transceivers enabling ultra-high-speed high dense input/output and interconnect for Terabyte per second optical interconnect" (California Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,321,025, issued on June 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated silicon photonics transceivers enabling ultra-high-speed high dense input/output and interconnect for Terabyte per second optical interconnect" was invented by Jianying Zhou (Dublin, Calif.) and Jin Hong (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an optical transceiver includes: a photonic integrated circuit (PIC) formed on a semiconductor die having a first side and a second side opposite the first side, where the first side includes a first optical circuit and a second optical circuit and the second side is to electrically ...