US Patent Issued to Intel on June 3 for "Integrated circuit (IC) package with substrate having validation connectors" (Mexican Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,685, issued on June 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit (IC) package with substrate having validation connectors" was invented by Luis Ricardo Perez-Corona (Tlaquepaque, Mexico), Maria Jose Garcia-Garcia de Leon (Zapopan, Mexico), Ricardo Astro-Bohorquez (Zapopan, Mexico) and Francisco Javier Ramirez-Aldana (Zapopan, Mexico).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein describe techniques for an IC package including a package substrate. The package substrate includes a set of validation connectors formed on a first side of the package substrate, a first set of functional connectors formed on t...