US Patent Issued to Intel on June 24 for "Through-substrate underfill formation for an integrated circuit assembly" (Malaysian, American Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,121, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Through-substrate underfill formation for an integrated circuit assembly" was invented by Eng Huat Goh (Ayer Itam, Malaysia), Kyle Davidson (Hillsboro, Ore.), Min Suet Lim (Penang, Malaysia), Kevin Byrd (Portland, Ore.) and James Wade (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package may be fabricated by disposing an underfill material between an electronic substrate and an integrated circuit device through an opening in the electronic substrate. In one embodiment, an integrated circuit assembly may include an electronic substrate ...