US Patent Issued to Intel on June 24 for "Substrateless double-sided embedded multi-die interconnect bridge" (Arizona Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,129, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Substrateless double-sided embedded multi-die interconnect bridge" was invented by Biancun Xie (Chandler, Ariz.), Jianyong Xie (Chandler, Ariz.), Sujit Sharan (Chandler, Ariz.), Debendra Mallik (Chandler, Ariz.) and Robert L. Sankman (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly including a substrate having a conductive plane; and a bridge having first contacts at a first surface and second contacts at an opposing second surface, wherein th...