US Patent Issued to Intel on June 24 for "Stacked memory chip solution with reduced package inputs/outputs (I/Os)" (Oregon, Washington Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,863, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Stacked memory chip solution with reduced package inputs/outputs (I/Os)" was invented by Chong J. Zhao (West Linn, Ore.), Shigeki Tomishima (Portland, Ore.), Kuljit S. Bains (Olympia, Wash.), James A. McCall (Portland, Ore.) and Dimitrios Ziakas (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stack of memory chips and a logic chip is placed within a same package. Multiple memory chips of the stack of memory chips are divided into fractions, and multiple internal channels within the package that emanate from the logic chip are coupled to respective ones of th...