US Patent Issued to Intel on June 24 for "Semiconductor device stack-up with bulk substrate material to mitigate hot spots" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,080, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor device stack-up with bulk substrate material to mitigate hot spots" was invented by Shrenik Kothari (Phoenix), Chandra Mohan Jha (Tempe, Ariz.), Weihua Tang (Chandler, Ariz.), Robert Sankman (Phoenix), Xavier Brun (Chandler, Ariz.) and Pooya Tadayon (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include semiconductor dies and methods of forming such dies. In an embodiment, the semiconductor die comprises a semiconductor substrate, an active device layer in the semiconductor substrate, where the active device layer co...