ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,092, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).
"Planar slab vias for integrated circuit interconnects" was invented by Elijah Karpov (Portland, Ore.), Manish Chandhok (Beaverton, Ore.) and Nafees Kabir (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuitry comprising devices electrically coupled through a plurality of interconnect levels in which lines of a first and second interconnect level are coupled through a planar slab via. An interconnect line may include a horizontal line segment within one of the first or second interconnect levels, and the slab via may be a vertical line segment bet...