US Patent Issued to Intel on June 24 for "Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling" (Arizona, California Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,114, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling" was invented by Georgios Dogiamis (Chandler, Ariz.), Qiang Yu (Saratoga, Calif.), Adel A. Elsherbini (Tempe, Ariz.) and Shawna M. Liff (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a die-level interposer having a first surface and an opposing second surface; a first die coupled to the first surface of the die-level interpos...