ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,281, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).
"Micro socket electrical couplings for dies" was invented by Srikant Nekkanty (Chandler, Ariz.), Debendra Mallik (Chandler, Ariz.), Joe F. Walczyk (Tigard, Ore.), Saikumar Jayaraman (Hillsboro, Ore.) and Feroz Mohammad (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein may be related to apparatuses, processes, and techniques related to micro socket arrays with fine pitch contacts to electrically couple dies, in particular photonics dies, within multichip photonics packages. In embodiments, micro socket arrays may be used in conjunctio...