US Patent Issued to Intel on June 24 for "Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates" (Arizona Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,117, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates" was invented by Kyle McElhinny (Tempe, Ariz.), Hongxia Feng (Chandler, Ariz.), Xiaoying Guo (Chandler, Ariz.), Steve Cho (Chandler, Ariz.), Jung Kyu Han (Chandler, Ariz.), Changhua Liu (Chandler, Ariz.), Leonel Arana (Phoenix), Rahul Manepalli (Chandler, Ariz.), Dingying Xu (Chandler, Ariz.) and Amram Eitan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus to reduce defects in interconnects between semiconductor dies and package su...