US Patent Issued to Intel on June 24 for "Deposition tool and method for filling deep trenches" (Oregon, California Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,065, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Deposition tool and method for filling deep trenches" was invented by Elijah V. Karpov (Portland, Ore.), Matthew Metz (Portland, Ore.) and Robert Willoner (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to semiconductor deposition tools having a specimen support, at least one ion gun directed to a specimen positioned on the specimen support, at least one source, and at least one electron beam gun directed at the source. In an aspect, the electron beam guns, sources, and ion beam guns are positioned below the specimen suppo...