US Patent Issued to Intel on June 24 for "Bare-die smart bridge connected with copper pillars for system-in-package apparatus" (German Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,096, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Bare-die smart bridge connected with copper pillars for system-in-package apparatus" was invented by Georg Seidemann (Landshut, Germany), Thomas Wagner (Regelsbach, Germany), Andreas Wolter (Regensburg, Germany) and Bernd Waidhas (Pettendorf, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor."

The patent was filed on April 8, 2022, under Application No. 17/716,958.

*For furth...