ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,472, issued on June 17, was assigned to Intel Corp. (Santa Clara, Calif.).
"Multiple wafer stack architecture to enable singulation" was invented by Omkar Karhade (Chandler, Ariz.) and Sairam Agraharam (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic stacked die package structures formed according to some embodiments may include a first die comprising a first conductive layer over a substrate layer. A second die may be on the first conductive layer. A third die is on the second die. An edge region of the stacked die package structure comprises a first portion over a second portion, the first portion comprising edges of...