US Patent Issued to Intel on June 17 for "Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates" (Arizona Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,422, issued on June 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates" was invented by Kyle McElhinny (Tempe, Ariz.), Onur Ozkan (Scottsdale, Ariz.), Ali Lehaf (Chandler, Ariz.), Xiaoying Guo (Chandler, Ariz.), Steve Cho (Chandler, Ariz.), Leonel Arana (Phoenix), Jung Kyu Han (Chandler, Ariz.), Srinivas Pietambaram (Chandler, Ariz.), Sashi Kandanur (Chandler, Ariz.) and Alexander Aguinaga (Tempe, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus to reduce defects in interconnects between semiconductor dies and pac...