ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,196, issued on June 17, was assigned to Intel Corp. (Santa Clara, Calif.).
"Magnetic core inductors on package substrates" was invented by Krishna Bharath (Chandler, Ariz.), Wei-Lun Jen (Chandler, Ariz.), Huong Do (Chandler, Ariz.) and Amruthavalli Alur (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronics package comprises a substrate comprising at least two conductive layers that are separated by a first dielectric. At least one island comprising a magnetic material is embedded within the dielectric between the two conductive layers. An inductor structure extends within a via in the at least one island. The via extends...