ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,197, issued on June 17, was assigned to Intel Corp. (Santa Clara, Calif.).
"In-plane inductors in IC packages" was invented by Brandon C. Marin (Chandler, Ariz.), Tarek Ibrahim (Mesa, Ariz.), Prithwish Chatterjee (Tempe, Ariz.), Haifa Hariri (Phoenix), Yikang Deng (Saratoga, Calif.), Sheng C. Li (Gilbert, Ariz.) and Srinivas Pietambaram (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package substrate, comprising a magnetic material embedded within a dielectric material. A first surface of the dielectric material is below the magnetic material, and a second surface of the dielectric material, opposite the f...