US Patent Issued to Intel on June 17 for "DIMM retention assembly for compression mount technology and land grid array connector loading" (Oregon, Washington Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,674, issued on June 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"DIMM retention assembly for compression mount technology and land grid array connector loading" was invented by Xiang Li (Portland, Ore.), George Vergis (Portland, Ore.) and Phil Geng (Washougal, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard are described, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an load member extending through an opening in the first lever, a second lever cou...