ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,826, issued on June 17, was assigned to Intel Corp. (Santa Clara, Calif.).
"Die-to-die interconnect" was invented by Debendra Das Sharma (Saratoga, Calif.), Swadesh Choudhary (Mountain View, Calif.), Narasimha Lanka (Dublin, Calif.), Lakshmipriya Seshan (Sunnyvale, Calif.), Gerald Pasdast (San Jose, Calif.) and Zuoguo Wu (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A port is to couple to another die over a die-to-die (D2D) link and includes physical layer (PHY) circuitry including a first number of sideband lanes to carry data for use in training and management of the D2D link, and a second number of mainband lanes to implement a...