ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,809, issued on June 10, was assigned to Intel Corp. (Santa Clara, Calif.).
"Vertically stacked and bonded memory arrays" was invented by Abhishek A. Sharma (Hillsboro, Ore.), Wilfred Gomes (Portland, Ore.) and Mauro J. Kobrinsky (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein are three-dimensional memory arrays that include multiple layers of memory cells. The layers are stacked and bonded to each other at bonding interfaces. The layers are formed on a support structure, such as a semiconductor wafer, that is grinded down before the layers are bonded. Vias extend through multiple layers of memory cells, including thro...