US Patent Issued to Intel on June 10 for "Thermal performance in hybrid bonded 3D die stacks" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,775, issued on June 10, was assigned to Intel Corp. (Santa Clara, Calif.).

"Thermal performance in hybrid bonded 3D die stacks" was invented by Feras Eid (Chandler, Ariz.), Adel Elsherbini (Tempe, Ariz.), Johanna Swan (Scottsdale, Ariz.), Shawna Liff (Scottsdale, Ariz.), Aleksandar Aleksov (Chandler, Ariz.) and Julien Sebot (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Hybrid bonded 3D die stacks with improved thermal performance, related apparatuses, systems, and methods of fabrication are disclosed. Such hybrid bonded 3D die stacks include multiple levels of dies including a level of the 3D die stack with one or more integrated ci...