ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,801, issued on June 10, was assigned to Intel Corp. (Santa Clara, Calif.).
"Robust mold integrated substrate" was invented by Jimin Yao (Chandler, Ariz.), Kyle Yazzie (Chandler, Ariz.) and Shawna M. Liff (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus, comprising an Integrated Circuit (IC) package comprising a dielectric, the IC package has a first surface and an opposing second-surface, wherein the first surface is separated from the second surface by a thickness of the IC package, wherein sidewalls extend along a perimeter and through the thickness between the first surface and the second surface, and a structure com...