ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,773, issued on June 10, was assigned to Intel Corp. (Santa Clara, Calif.).
"Package with underfill containment barrier" was invented by Rahul Jain (Gilbert, Ariz.), Kyu Oh Lee (Chandler, Ariz.), Siddharth K. Alur (Chandler, Ariz.), Wei-Lun K. Jen (Chandler, Ariz.), Vipul V. Mehta (Chandler, Ariz.), Ashish Dhall (Chandler, Ariz.), Sri Chaitra J. Chavali (Chandler, Ariz.), Rahul N. Manepalli (Chandler, Ariz.), Amruthavalli P. Alur (Tempe, Ariz.) and Sai Vadlamani (Gilbert, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component si...