ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,807, issued on June 10, was assigned to Intel Corp. (Santa Clara, Calif.).
"High density substrate routing in package" was invented by Weng Hong Teh (Cambridge, Mass.) and Chia-Pin Chiu (Tempe, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Discussed generally herein are devices that include high density interconnects between dice and techniques for making and using those devices. In one or more embodiments a device can include a bumpless buildup layer (BBUL) substrate including a first die at least partially embedded in the BBUL substrate, the first die including a first plurality of high density interconnect pads. A second die can be at leas...