ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,794, issued on June 10, was assigned to Intel Corp. (Santa Clara, Calif.).
"Die coupling using a substrate with a glass core" was invented by Telesphor Kamgaing (Chandler, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein may be related to apparatuses, processes, and techniques related to via structures and/or planar structures within a glass core of a substrate to facilitate high-speed signaling with a die coupled with the substrate. In embodiments, the substrate may be coupled with an interposer to enable high-speed signaling between a compute die (or tile) and a storage die (...