ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,749, issued on June 10, was assigned to Intel Corp. (Santa Clara, Calif.).

"Carrier chuck and methods of forming and using thereof" was invented by Deniz Turan (Chandler, Ariz.), Yosef Kornbluth (Phoenix) and Yonggang Li (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a carrier chuck having a base plate with a top surface, at least one electrode positioned in a first carrier region of the top surface and configured to produce an electrostatic force to retain a panel placed on the carrier chuck during panel processing, and a dielectric layer positioned over the at least one electrode. The at least...