US Patent Issued to Intel on June 10 for "Asymmetrical laminated circuit boards for improved electrical performance" (Malaysian Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,816, issued on June 10, was assigned to Intel Corp. (Santa Clara, Calif.).

"Asymmetrical laminated circuit boards for improved electrical performance" was invented by Jackson Chung Peng Kong (Pulau Pinang, Malaysia), Bok Eng Cheah (Pulau Pinang, Malaysia), Tin Poay Chuah (Pulau Pinang, Malaysia), Jenny Shio Yin Ong (Pulau Pinang, Malaysia) and Seok Ling Lim (Kulim Kedah, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a printed circuit board assembly including a first circuit board including a first footprint, the first circuit board further includes a plurality of first vertical vias extending between a fir...