US Patent Issued to Intel on July 8 for "Omni directional interconnect with magnetic fillers in mold matrix" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,883, issued on July 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Omni directional interconnect with magnetic fillers in mold matrix" was invented by Bohan Shan (Chandler, Ariz.), Dingying Xu (Chandler, Ariz.), Kristof Darmawikarta (Chandler, Ariz.), Srinivas Venkata Ramanuja Pietambaram (Chandler, Ariz.), Hongxia Feng (Chandler, Ariz.), Gang Duan (Chandler, Ariz.), Jung Kyu Han (Chandler, Ariz.), Xiaoying Guo (Chandler, Ariz.), Jeremy D. Ecton (Gilbert, Ariz.), Santosh Tripathi (Portland, Ore.), Bai Nie (Chandler, Ariz.), Haobo Chen (Chandler, Ariz.), Kyle Jordan Arrington (Gilbert, Ariz.), Yue Deng (Chandler, Ariz.) and Wei Wei (Chandler, Ariz.).

According to the abstra...