US Patent Issued to Intel on July 8 for "Interconnect structures with different metal materials" (Oregon Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,957, issued on July 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Interconnect structures with different metal materials" was invented by Carl H. Naylor (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques are provided herein for forming interconnect structures, such as conductive vias or contacts, that are protected from subsequent processing that includes reactive gas or plasma. A conductive via or contact within an interconnect layer may be formed with a capping layer having a different material to protect the underlying metal material from reacting with certain reactive gas or plasma elements. In some examples, a rut...