US Patent Issued to Intel on July 8 for "First layer interconnect first on carrier approach for EMIB patch" (Arizona Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,992, issued on July 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"First layer interconnect first on carrier approach for EMIB patch" was invented by Changhua Liu (Chandler, Ariz.), Xiaoying Guo (Phoenix), Aleksandar Aleksov (Chandler, Ariz.), Steve S. Cho (Chandler, Ariz.), Leonel Arana (Phoenix), Robert May (Chandler, Ariz.) and Gang Duan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A patch structure of an integrated circuit package comprises a core having a first side facing downwards and a second side facing upwards. A first solder resist (SR) layer is formed on the first side of the core, wherein the first SR layer com...